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DATA SHEET
SKY65152-11: 2.4-2.5 GHz WLAN Power Amplifier
Applications
IEEE 802.11 b/g WLANs ISM band transmitters WCS fixed wireless Wireless access nodes
Description
The SKY65152-11 is a Microwave Monolithic Integrated Circuit (MMIC) Power Amplifier (PA) with superior output power, linearity, and efficiency. These features make the SKY65152-11 ideal for Wireless Local Area Network (WLAN) applications. The high linearity (low EVM) and high efficiency of this device makes it ideal for use in the transmit chain of WLAN access points or modems. The SKY65152-11 is fabricated using Skyworks high reliability Heterojunction Bipolar Transistor (HBT) InGaP process, which allows for single supply operation while maintaining high efficiency and good linearity. The device is internally matched and mounted in a 20-pin, 6 x 6 mm Multi-Chip Module (MCM) Surface-Mounted Technology (SMT) package, which allows for a highly manufacturable low cost solution. A functional block diagram is shown in Figure 1. The pin configuration and package are shown in Figure 2. Signal pin assignments and functional pin descriptions are provided in Table 1.
RF_IN
18
Features
EVM < 2.5% for POUT > +27 dBm High gain = 32 dB Internal RF match with DC block and active bias circuits Internal on/off control circuit Internal, high dynamic range power detector Single DC supply = +5 V Operating temperature = -40 C to +85 C Small, MCM (20-pin, 6 x 6 mm) package (MSL3, 260 C per JEDEC J-STD-020) Skyworks offers lead (Pb)-free RoHS (Restriction of Hazardous Substances) compliant packaging.
GND
GND
GND GND
VREF1 VC_BIAS RREF1 VREF2 PA_ENB VREF3 VCC_DET
1
20
19
GND
17
16
VCC1 VCC_DET V_DET VCC2 N/C VCC3
2
15
RREF2
RREF3
PA_ENB VC_BIAS VREF1
Output Match RF_OUT
3
14
4
13
Active Bias
Detector
V_DET
RF_IN
Input Match
InterStage Match
InterStage Match
5
12
VREF2
VCC1 VCC2 VCC3
S1503
6
7
8
9
10
11
VREF3
RF_OUT
GND
GND
Figure 1. SKY65152-11 Block Diagram
S1504
Figure 2. SKY65152-11 Pinout - 20-Pin MCM (Top View)
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DATA SHEET * SKY65152-11 POWER AMPLIFIER
Table 1. SKY65152-11 Signal Descriptions
Pin # 1 2 3 4 5 6 7 8 9 10
Note:
Name GND GND PA_ENB VC_BIAS VREF1 VREF2 VREF3 GND RF_OUT GND Ground Ground
Description
Pin # 11 12 13 14 15 16 17 18 19 20 VCC3 N/C VCC2 V_DET
Name
Description Stage 3 collector voltage No connection Stage 2 collector voltage Detector output signal Detector supply voltage Stage 1 collector voltage Ground RF input Ground Ground
PA on/off control signal (on = +3 V to VCC; off = 0 to 0.5 V) Bias voltage Bias reference voltage 1 Bias reference voltage 2 Bias reference voltage 3 Ground RF output Ground
VCC_DET VCC1 GND RF_IN GND GND
The center attachment pad must have a low inductance and low thermal resistance connection to the printed circuit board ground plane.
Functional Description
The SKY65152-11 is a three-stage, HBT InGaP device optimized for high linearity and power efficiency. It contains all of the needed RF matching and DC biasing circuits. An in-module active bias circuit is included within the device for all three amplifier stages, which provides excellent gain tracking over temperature and voltage variations. The first, second, and output stages are independently supplied using the VCC1, VCC2, and VCC3 signals (pins 16, 13 and 11,respectively). The DC control voltage that sets the bias for all three stages is supplied by the VC_BIAS signal (pin 4). The Evaluation Board includes shunt decoupling capacitors on these pins to suppress any possible bias affect on the RF signal at low frequencies. The bias reference voltages for stages 1, 2, and 3 are supplied using the common lines VREF1, VREF2, and VREF3 (pins 5, 6, and 7, respectively). The maximum voltage for these pins is 4 V. Resistors R1, R2, and R3 on the Evaluation Board set the correct bias to these pins when attached to a 5 V power supply. The SKY65152-11 includes an internal PA enable control pin (pin 3) for fast RF on/off control. Zero volts turns off the PA while 3 to 5 V enables the PA. The device also provides an output power detector voltage, V_DET, at pin 14. A bias voltage is required to operate the detector. The detector supply voltage is provided
through the VCC_DET signal (pin 15). The maximum voltage for this pin is 4 V. Resistor R5 on the Evaluation Board sets the correct bias to this pin when attached to a 5 V power supply. Pin 18 is the RF input and Pin 9 is the RF output. External DC blocking or RF matching is not required on the RF input and output. Grounding is through several ground pins and the package center ground. These features make the device suitable for wideband digital applications where PA linearity and power consumption are of critical importance (e.g., WLANs). The device has been characterized with the highest specified data rates for 802.11b (11 Mbps) and 802.11g (54 Mbps). Under these stringent test conditions, the device exhibits excellent spectral purity and power efficiency.
Electrical and Mechanical Specifications
The absolute maximum ratings of the SKY65152-11 are provided in Table 2. The recommended operating conditions are specified in Table 3 and electrical specifications are provided in Table 4. Performance characteristics for the SKY65152-11 are illustrated in Figures 3 through 14.
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DATA SHEET * SKY65152-11 POWER AMPLIFIER
Table 2. SKY65152-11 Absolute Maximum Ratings (Note 1)
Parameter RF output power Supply voltage (VCC, VC_BIAS, and PA_ENB) (Note 2) Total supply current Reference voltage (Note 2) Detector supply voltage (VCC_DET) (Note 2) Power dissipation Case temperature Storage temperature Junction temperature Thermal resistance PD TC TSTG TJ JC -40 -55 POUT VCC ICC VREF 4.5 Symbol Minimum Maximum +30 5.5 850 4 4 3.3 +85 +125 +150 20 Units dBm V mA V V W C C C C/W
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. Note 2: Voltage levels measured at the pins of the package. The Evaluation Board supply voltage levels may be different. Refer to the Evaluation Board schematic diagram in this document.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SKY65152-11 Recommended Operating Conditions
Parameter RF output power Supply voltage (Note 1) Reference voltage (Note 1) Detector supply voltage (Note 1) Operating frequency Case temperature POUT VCC, VC_BIAS VREF VCC_DET f TC 2412 -40 +25 Symbol Minimum Typical +27 5 2.5 3.6 2462 +85 Maximum Units dBm V V V MHz C
Note 1: Voltage levels measured at the pins of the package. The Evaluation Board supply voltage levels may be different. Refer to the Evaluation Board schematic diagram in this document.
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DATA SHEET * SKY65152-11 POWER AMPLIFIER
Table 4. SKY65152-11 Electrical Specifications (Note 1) (VCC1 = VCC2 = VCC3 = VREF1 = VREF2 = VREF3 = VC_BIAS = VCC_DET = PA_ENB = 5 V, Characteristic Impedance [ZO] = 50 , TC = 25 C, Frequency = 2.442 GHz, Unless Otherwise Noted)
Parameter Symbol Test Condition Min Typical Max Units IEEE 802.11g Orthogonal Frequency Division Multiplexing Input Signal, Data Rate = 54 Mbps Error Vector Magnitude Continuous Wave Input Signal Small signal gain Gain flatness over band Gain flatness over channel Input return loss 2nd harmonics Detector voltage Operational current Output power @ 1 dB compression Quiescent current Noise Figure Power Up/Down Control Power up Power down Standby current PA_ENB on PA_ENB off ISB PA_ENB = 0 V 3 5 0 3 0.5 5 V V A G POUT POUT_EVM |S11| 2fo VDET ICC P1dB ICCQ NF No RF CW input POUT = +27 dBm Peak POUT = +27 dBm +32 0.79 PIN = -25 dBm 2.4 GHz to 2.5 GHz Over any 16.25 MHz within band 30 32 1.0 0.10 -12 -16.5 0.83 790 +33 490 5 510 6.5 1.4 0.15 -10 -14.0 0.87 830 dB dB dB dB dBm V mA dBm mA dB EVM POUT = +27 dBm 2 2.5 %
Note 1: Performance is guaranteed only under the conditions listed in this Table and is not guaranteed over the full operating or storage temperature ranges. Operation at elevated temperatures may reduce reliability of the device.
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DATA SHEET * SKY65152-11 POWER AMPLIFIER
Typical Performance Characteristics
(VCC1 = VCC2 = VCC3 = VREF1 = VREF2 = VREF3 = VC_BIAS = VCC_DET = PA_ENB = 5 V, CW, Characteristic Impedance [ZO] = 50 , TC = 25 C, Frequency = 2.442 GHz, Unless Otherwise Noted)
34.0
34 33 32
33.5 33.0
Gain (dB)
31 30 29 28 27 +12 +14 +16 +18 +20 +22 +24 +26 +28 +30 +32 +34 +36 +38
2462 MHz 2442 MHz 2412 MHz
Gain (dB)
32.5 32.0 31.5 31.0 2400
2410
2420
2430
2440
2450
2460
2470
2480
2490
2500
POUT (dBm)
Frequency (MHz)
Figure 3. Gain vs Output Power Over Frequency
Figure 4. Small Signal Gain vs Frequency
3.0 2.5
1200 1000
Current (mA)
EVM (%)
2.0
800 600 400 200 0 +12 +16
ICC1 ICC2 ICC3 Total
1.5
2462 MHz 2442 MHz 2412 MHz
1.0
0.5 +14
+15
+16
+17 +18
+19
+20
+21 +22
+23
+24
+25 +26 +27 +28
+20
+24
+28
+32
POUT (dBm)
POUT (dBm)
Figure 6. Current vs Output Power
Figure 5. EVM vs Output Power Over Frequency (802.11g, OFDM, 64 QAM @ 54 Mbps)
+40
+40 +30 <2.0 s @ 90% Peak RF Power +20
+30 +20 <2.0 s @ 90% Peak RF Power
RF Power (dBm)
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
+10 0 -10 -20 -30 -40 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
RF Power (dBm)
+10 0 -10 -20 -30 -40
Time (s)
Time (s)
Figure 7. Output Power vs Enable Time
Figure 8. Output Power vs Disable Time
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DATA SHEET * SKY65152-11 POWER AMPLIFIER
+10 0 -10 -20 -30 -40 -50 2.412 2.422 2.432 2.442 2.452 2.462 2.472
+10 0 -10 -20 -30 -40 -50 -60 -70 2.412
Normalized POUT (dBc)
Normalized POUT (dBc)
2.422
2.432
2.442
2.452
2.462
2.472
Frequency (GHz)
Frequency (GHz)
Figure 9. Spectral Response @ POUT = + 30 dBm (802.11g, OFDM, 64 QAM @ 54 Mbps)
Figure 10. Spectral Response @ POUT = +31 dBm (802.11b, CCK @ 11 Mbps)
40 35 30
-10 -15
2nd Harmonic Level (dBm)
25
PAE (%)
-20 -25 -30 -35 -40
20 15 10 5 0 +12
802.11b CW
+14
+16
+18
+20
+22
+24
+26
+28
+30
+32
+34
+36
-45 +20
+21
+22
+23
+24
+25
+26
+27
+28
+29
+30
POUT (dBm)
Output Power (dBm)
Figure 11. PAE vs Output Power
Figure 12. Second Harmonic vs Output Power
1.6
-40
1.4
Detector Voltage (V)
3rd Harmonic Level (dBm)
-45
1.2 1.0 0.8 0.6 0.4 0.2
2462 MHz 2442 MHz 2412 MHz
-50
-55
-60
802.11b CW
+24.5 +25.0 +25.5 +26.0 +26.5 +27.0
-65 +24.0
0 +10 +12 +14
+16 +18
+20 +22 +24
+26 +28
+30 +32
+34
Output Power (dBm)
POUT (dBm)
Figure 13. Third Harmonic vs Output Power
Figure 14. Detector Voltage vs Output Power
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DATA SHEET * SKY65152-11 POWER AMPLIFIER
Evaluation Board Description
The SKY65152-11 Evaluation Board is used to test the performance of the SKY65152-11 PA. An Evaluation Board schematic diagram is provided in Figure 15. An assembly drawing for the Evaluation Board is shown in Figure 16. An Evaluation Board layer detail drawing is shown in Figure 17. Layer detail physical characteristics are noted in Figure 18. Table 5 provides the Bill of Materials (BOM) list for Evaluation Board components. Circuit Design Considerations The following design considerations are general in nature and must be followed regardless of final use or configuration: 1. Paths to ground should be made as short as possible. 2. The ground pad of the SKY65152-11 has special electrical and thermal grounding requirements. This pad is the main thermal conduit for heat dissipation. Since the circuit board acts as the heat sink, it must shunt as much heat as possible from the device. Therefore, design the connection to the ground pad to dissipate the maximum wattage produced by the circuit board. Multiple vias to the grounding layer are required. 3. Bypass capacitors should be used on the DC supply lines. An RF inductor is required on the VCC supply line to block RF signals from the DC supply. Refer to the schematic drawing in Figure 15 for further details. 4. The RF lines should be well separated from each other with solid ground in between traces to maximize input-to-output isolation.
NOTE: A poor connection between the slug and ground increases junction temperature (TJ), which reduces the lifetime of the device. Evaluation Board Test Procedure Step 1: Connect a +5 V supply to the VCC1, VCC2, VCC3, VREF1, VREF2, VREF3, VC_BIAS, VCC_DET, and PA_ENB pins. If available, enable the current limiting function of the power supply to 1000 mA. Step 2: If desired, connect a voltage meter to the V_DET pin. Step 3: Connect a signal generator to the RF signal input port. Set it to the desired RF frequency at a power level of -15 dBm or less to the Evaluation Board. DO NOT enable the RF signal. Step 4: Connect a spectrum analyzer to the RF signal output port. Step 5: Enable the power supply. Step 6: Enable the RF signal. Step 7: Take measurements. CAUTION: If the input signal exceeds the rated power, the SKY65152-11 Evaluation Board can be permanently damaged. NOTE: It is important to adjust the VCC voltage source so that +5 V is measured at the board. The high collector currents will drop the collector voltage significantly if long leads are used. Adjust the bias voltage to compensate.
RF Input
20
19
18
17
GND
GND
RF_IN
GND
1 2 3 4 C11 10 F C1 3300 pF
GND GND PA_ENB
VCC1 VCC_DET V_DET
16 15 14 13 L2 27 nH R5 300
C5 8.2 pF
C15 10 F
Collector Voltage 1 (5 V)
C6 3300 pF C7 8.2 pF
Detector Supply Voltage (5 V) Detector Output Collector Voltage 2 (5 V)
PA Enable (0-5 V) Bias Voltage (5 V)
SKY65152-11
VC_BIAS VREF1 VCC2 N/C
5 6
12 11
x
C8 8.2 pF
C16 10 F
Reference Voltage (5 V)
R1 560
VREF3
VREF2
RF_OUT
VCC3
Collector Voltage 3 (5 V)
C10 8.2 pF C17 10 F
GND
R2 180 C2 3300 pF
7
8
9
10
R3 180
RF Output
S1502
Figure 15. SKY65152-11 Evaluation Board Schematic
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GND
DATA SHEET * SKY65152-11 POWER AMPLIFIER
PA_ENB
C11
C5
C15
VCC1
C6 R5 C7
VC_BIAs VREF GND GND
J3
C2 C1 R1 R2 R3 C10 C8
VCC_DET
L2 C16
U1
J4
VDET VCC2
C17
VCC3
S1505
Figure 16. SKY65152-11 Evaluation Board Assembly Diagram
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DATA SHEET * SKY65152-11 POWER AMPLIFIER
Layer 1: Silk Screen
Layer 1: Top Metal
Layer 2 and 3: Ground
Layer 4: Backside Ground
S1508
Figure 17. SKY65152-11 Evaluation Board Layer Detail
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DATA SHEET * SKY65152-11 POWER AMPLIFIER
Cross Section
Name Thickness (mils) Material
L1 Lam1 L2 GND Lam2 L3 GND Lam3 L4 1.4 12 1.4 4 1.4 12 1.4 Cu Rogers 4003-12 Cu, 1 oz. FR4-4 Cu, 1 oz. FR4-12 Cu, 1 oz.
r
- 3.38 - 4.35 - 4.35 -
Figure 18. Evaluation Board Layer Detail Physical Characteristics
Table 5. SKY65152-11 Evaluation Board Bill of Materials
Component C1, C2, C6 C5, C7, C8, C10 C11, C15, C16, C17 L2 R1 R2, R3 R5 Value 3300 pF 8.2 pF 10 F 27 nH 560 180 300 0603 0603 0603 0603 0603 0603 0603 Size Product # 5404R28-015 5404R98-010 5404R91-005 5332R34-030 5424R20-045 5424R20-031 5424R20-036 Manufacturer Murata Murata TDK Taiyo-Yuden Rohm Rohm Rohm Manufacturer's Part # GRM188R71H332KD01J GRM1885C1H8R2CZ01D C3216X5R0J106KT HK160827NJ-T MCR03EZHUJ680 MCR03EZHUJ180 MCR03EZHUJ300 Characteristics X7R, 50 V, 10% C0G, 50 V, 0.25 pF X5R, 6 V, 10% 5%, SRF 2200 MHz 50 V, 0.063 W, 5% 50 V, 0.063 W, 5% 50 V, 0.063 W, 5%
Application Circuit Notes Center Ground. It is extremely important to sufficiently ground the bottom ground pad of the device for both thermal and stability reasons. Multiple small vias are acceptable and will work well under the device if solder migration is an issue. GND (pins 1, 2, 8, 10, 17, 19, and 20). Attach all ground pins to the RF ground plane with the largest diameter and lowest inductance via that the layout allows. Multiple small vias are acceptable and will work well under the device if solder migration is an issue. PA_ENB (pin 3). Internal PA enable control pin for fast on/off control (on = +3 V to VCC; off = 0 to 0.5 V). VC_BIAS (pin 4). The bias supply voltage for stages 1 and 2, typically set to +5 V. VREF1 (pin 5). Bias reference voltage for amplifier stage 1. This signal should be operated over the same voltage range as VCC with a nominal voltage of +5 V. VREF2 (pin 6). Bias reference voltage for amplifier stage 2. This signal should be operated over the same voltage range as VCC with a nominal voltage of +5 V. VREF3 (pin 7). Bias reference voltage for amplifier stage 3. This signal should be operated over the same voltage range as VCC with a nominal voltage of +5 V.
RF_OUT (pin 9). Amplifier RF output pin (ZO = 50 ). The module includes an onboard internal DC blocking capacitor. All impedance matching is provided internal to the module. VCC3 (pin 11). Supply voltage for the output (final) stage collector bias (typically +5 V). To bypass VCC3, capacitors C10 and C17 (see Figure 15) should be placed in the approximate location shown on the Evaluation Board, although exact placement is not critical. N/C (pin 12). This pin is open and may or may not be connected to ground. VCC2 (pin 13). Supply voltage for the second stage collector bias (typically +5 V). To bypass VCC2, capacitors C8 and C16 (see Figure 15) should be placed in the approximate location shown on the Evaluation Board, although exact placement is not critical. V_DET (pin 14). The output power detector voltage signal. The detector load and settling time constant are set external to the device. Inductor L2 and capacitor C7 (see Figure 15) are set to yield a settling time of < 0.5 s. VCC_DET (pin 15). The power detector supply voltage signal. Resistor R5 and capacitor C5 (see Figure 15) are used for proper bias and bypassing of this pin. VCC_DET (pin 15) may be connected to the PA_ENB supply (pin 3). The benefit of this is that the current draw consumed by the detector will not be wasted with the device in the off state.
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DATA SHEET * SKY65152-11 POWER AMPLIFIER
VCC1 (pin 16). Supply voltage for the first stage collector bias (typically +5 V). To bypass VCC1, capacitors C5 and C15 (see Figure 15) should be placed in the approximate location shown on the Evaluation Board, although exact placement is not critical. RF_IN (pin 18). Amplifier RF input pin (ZO = 50 ). The module includes an onboard internal DC blocking capacitor. All impedance matching is provided internal to the module.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is baked and vacuum packed before shipping. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. THE SKY65152-11 is rated to Moisture Sensitivity Level 3 (MSL3) at 260 C. It can be used for lead or lead-free soldering. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format. For packaging details, refer to the Skyworks Application Note, Tape and Reel Information - RF Modules, document number 101568.
Package Dimensions
The PCB layout footprint for the SKY65152-11 is shown in Figure 19. Typical case markings are shown in Figure 20. Package dimensions for the 20-pin MCM are shown in Figure 21, and tape and reel dimensions are provided in Figure 22.
Thermal Via Array O0.3 mm On 0.6 mm Pitch Improves Thermal Performance Pin 20 Pin 1 0.25 Typ.
13X 0.75
13X 0.5
6.3 1 Typ.
0.6 Typ.
Package Outline 0.6 Typ. 6.3
Pin 20 Pin 1
Metallization Top View
20X 0.85 Pin 1 20X 0.6 2X 1.7 6.4
Pin 20
20X 0.75
20X 0.5 2X 1.7 6.3 1 Typ. Stencil Aperture Size of 80 to 100% of the Module/Pkg. Solder Mask Opening 2X 1.7 6.3
1 Typ.
Package Outline
2X 1.7 6.4
Package Outline
Solder Mask Opening Top View
All dimensions are in millimeters
Stencil Aperture Top View
S1507
Figure 19. SKY65152-11 PCB Layout Footprint
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DATA SHEET * SKY65152-11 POWER AMPLIFIER
Pin 1 Identifier Manufacturing Part Number Revision Number Lot Number Y = Manufacture Year WW = Week Packaged Sealed MX = Country Code
SKY65152-11 EXXXXX.XX YYWW MX
Figure 20. SKY65152-11 Typical Case Markings
12X 2.9
12X 1.5
12X 0.5
Pin 20 See Detail B Pin 1
Pin 1
6
B C 4X 2.5
12X 1.5 12X 0.5 6 0
A
8X 2.9 1.05 0.1 0.15 A B C A 0.1 16X Solder Mask Opening See Detail C 0.2 A B C 20X SMT Pad 0.15 A B C
Top View
0.5 0.1 (0.1)
Side View
Bottom View
0.875 0.2 x 0.2
0.875
0.5 0.05
0.875 Metal Pad Edge
0.875
Solder Mask Edges Solder Mask Edges
Detail A
Pad Scale: 3X
All dimensions are in millimeters Dimensioning and tolerancing according to ASME Y14.5M-1994 6X This rotation 6X Rotated 180o 4X Rotated 90o CW 4X Rotated 90o CCW
Detail B
Scale: 2X
15X Detail C
Scale: 2X
S1679
Figure 21. SKY65152-11 20-Pin MCM Package Dimensions
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DATA SHEET * SKY65152-11 POWER AMPLIFIER
2.00 0.05 1.50 0.10 0.30 0.02 Pin #1 Indicator (see Notes) 8.00 4.00
B
1.75 0.10
5.50 0.05
A
6.35
A
7o Max. 1.59
B
1.50 Min. 6.35
B
Notes: 1. Carrier tape: black conductive polystyrene 2. Cover tape material: transparent conductive PSA 3. Cover tape size: 9.3 mm width 4. All dimensions are in millimeters 5. Pin 1 orientation is in top left corner for the following Skyworks products: SKY73022-21, -31 SKY73023-21, -31 For all other 6 x 6 mm MCM/RFLGA products, pin 1 orientation is in top right corner.
8o Max.
A
S1183
Figure 22. SKY65152-11 20-Pin MCM Tape and Reel Dimensions
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12.00 0.30
DATA SHEET * SKY65152-11 POWER AMPLIFIER
Ordering Information
Model Name SKY65152-11 WLAN Power Amplifier Manufacturing Part Number SKY65152-11 (Pb-free package) Evaluation Kit Part Number TW16-D280-031
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14 October 19, 2009 * Skyworks Proprietary Information * Products and Product Information are Subject to Change Without Notice * 200968F

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